Chip 1 Laboratory, a division of Chip 1 Exchange, offers a wide range of testing and value-added services to ensure the quality and reliability of electronic components. Our state-of-the-art equipment and experienced technicians provide accurate and efficient testing solutions for various applications.

• 2D X-ray Analysis:

Determine the presence of chips within housings of conspicuous goods.

Examine bonding materials for integrity and quality.

Analyze covered soldering joints, such as BGA components, for defects.

Evaluate through-hole filling in THT PCB technology and void ratios.

• 3D X-ray Analysis:

Create detailed 3D models from cross-sectional images using specialized software.

Visualize plug contacts, solder-filled sleeves, and internal structures with high precision.

Identify hidden defects and anomalies that may be difficult to detect with 2D analysis.

• SEM-EDX:

Capture high-resolution images with exceptional depth of field and magnification.

Analyze details at the nanometer scale for failure analysis of material surfaces and interfaces.

Determine elemental composition and distribution using energy-dispersive X-ray spectroscopy.

• Automated Solderability Test:

Measure wetting forces of component connections for various pin geometries.

Conduct dip & look tests with pre- and post-test microscopy images.

Assess component solderability according to industry standards (e.g., J-STD-002).

Identify potential soldering issues and process optimization opportunities.

• Electrical Test:

Verify component parameters against datasheet specifications over the entire frequency range.

Perform function tests in real-world applications to assess component performance.

Conduct signature analysis to detect damage, defects, and counterfeit components.

• Component Counting X-ray:

Accurately determine component quantities directly on reels.

Reduce the effort involved in incoming goods inspections and inventory checks.

• X-ray Fluorescence Analysis (XRF):

Qualitatively and quantitatively analyze material composition.

Identify elements present in samples using spectral analysis.

Determine material purity and detect impurities.

• Micro-Sectioning:

Prepare microsection samples for detailed analysis.

Examine assemblies, solder joints, components, chips, and bondings.

Visualize material transitions and measure layer thicknesses.

Identify defects, root causes, and potential failures.

• Digital Microscopy:

Examine solder joints, prepared samples, and component surfaces.

Achieve magnifications up to 2500x for precise analysis.

Perform 2D and 3D measurements and create height profiles.

Assess component surfaces for discoloration, abnormalities, and compliance with IPC-A-610 standards.

• Component Decapsulation:

Remove housing material using thermal or wet-chemical methods.

Inspect chip surfaces for bonding, marking, and inscriptions.

Conduct failure analysis on opened components.

• Reballing:

Replace defective or damaged BGA balls with new solder reservoirs.

Address issues like deformations, cracks, oxidation, and impurities.

Convert BGA-Ball alloys from lead-containing to lead-free.

Meet component availability, faulty assembly, and customer requirements.

• Tape and Reel:

Prepare SMD components for automated assembly according to customer specifications.

Ensure efficient processing on SMD lines.

• Acetone Wipe Test:

Detect rework on component housing surfaces.

Identify color changes on cotton swabs.

Conduct additional tests like scratch tests and solvent analysis if required.

UNCOMPROMISING QUALITY ASSURANCE:

Ensure your electronic components meet the highest standards of quality and reliability. Our rigorous testing processes identify potential issues early, preventing costly failures and ensuring optimal performance. 

SIGNIFICANT COST SAVINGS:

Reduce waste and rework expenses by catching defects before they reach your production line. Our efficient testing solutions can help you save time and money. 

STREAMLINED EFFICIENCY:

Optimize your quality control processes with our comprehensive testing services. Our streamlined workflows and expert technicians help you improve efficiency and reduce turnaround times. 

LEVERAGE OUR EXPERTISE:

Benefit from our team of highly skilled technicians and engineers with years of experience in the electronics industry. Our expertise ensures accurate and reliable testing results. 

ACCESS A COMPREHENSIVE SUITE OF SERVICES:

Optimize your quality control processes with our comprehensive testing services. Our streamlined workflows and expert technicians help you improve efficiency and reduce turnaround times. 

• Book Your Appointment: Simply fill out the form, and we'll get back to you to confirm your meeting time.

• Claim Your Free Ticket: Once your appointment is confirmed, we'll send you your free ticket along with all the event details.

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USA: +1 469 998 2227

Brazil: +55 113 958 7992

Mexico: +52 551 168 9735

Germany: +49-(0) 6102-8169-0

Asia: +632 7001 7367

China: +86 158 0186 6688

Email: info@chip1.com

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Chip 1 Exchange is a franchised distributor specializing in the distribution of electronic components for medical, automotive, industrial, mobile computing and aerospace applications. From off the shelf standard electronic products to full custom solutions, we desire our customers to enjoy a one-stop-shopping experience.

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